Application Background
Dry‑etching process is widely adopted in chip manufacturing. The silicon wafer is placed as the positive electrode at the bottom of the etching chamber. The gas distribution plate with dense tiny through‑holes, serving as the negative electrode, is mounted on top of the chamber. With proper voltage applied and acidic plasma etching gas introduced, micro‑fabrication is performed on the silicon wafer inside the high‑temperature chamber according to circuit patterns defined by lithography, so as to etch the wafer surface to the designed line width and depth and form micro‑integrated circuits.
The upper and lower electrodes are in direct contact with plasma. While etching the silicon wafer, plasma also wears out both electrodes. Electrodes suffer gradual physical and chemical corrosion from etching gas. Once worn to a certain level, electrodes must be replaced to guarantee uniform etching. The evenly‑distributed holes on the upper electrode (shower head / gas distribution plate) will deviate in dimension due to etching‑gas corrosion and need replacement when tolerance limits are exceeded.

Solution Analysis
🔹 Tests on φ0.45 mm PCD micro‑drill machining monocrystalline silicon show minimal hole‑edge chipping. Under microscope inspection, hole roundness tolerance is less than 0.005 mm, dimensional accuracy within ±0.003 mm, and surface roughness ≤Ra0.2 μm, meeting customer requirements.
🔹 In preliminary tests, the drill presents slight edge wear after machining 3500 holes and remains usable.
🔹 Worldia PCD micro‑drills are divided into four series (WZ1, WZ2, WZ3 and WZ‑X) according to processed materials and application scenarios, with diameter range of φ0.1‑φ1.0 mm. The solid PCD drills adopt self‑centering design, supporting maximum depth‑to‑diameter ratio up to 57:1. Chip‑flutes are manufactured by integral grinding for smooth chip evacuation. Machined hole‑wall finish can reach Ra0.2 μm or better with little hole‑edge chipping. The PCD drill tip delivers excellent wear resistance, long tool life and high dimensional consistency. The products satisfy micro‑hole machining demands for monocrystalline silicon, polycrystalline silicon, SiC, ceramics, fused silica and other materials in semiconductor industry.

Data Source: Tool Test Report of Precision Tool Technology Department of Beijing Worldia Diamond Tools CO., Ltd.

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